The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Jan. 10, 2018
Applicant:
Robert Bosch Gmbh, Stuttgart, DE;
Inventors:
Christoph Schelling, Stuttgart, DE;
Ricardo Zamora, Stuttgart, DE;
Assignee:
Robert Bosch GmbH, Stuttgart, DE;
Primary Examiner:
Int. Cl.
CPC ...
G01C 19/5712 (2012.01); B81C 1/00 (2006.01); G01L 9/00 (2006.01); G01L 9/12 (2006.01); G01P 15/08 (2006.01); G01P 15/125 (2006.01);
U.S. Cl.
CPC ...
G01C 19/5712 (2013.01); B81C 1/00182 (2013.01); B81C 1/00357 (2013.01); G01L 9/0005 (2013.01); G01L 9/12 (2013.01); G01P 15/0802 (2013.01); G01P 15/125 (2013.01); B81C 2201/014 (2013.01); B81C 2201/019 (2013.01);
Abstract
A micromechanical sensor includes a base substrate, a cap substrate, and a MEMS substrate that is connected to each of the base and cap substrates by respective metallic bond connections and that includes a mechanical functional layer including movable MEMS elements, an electrode device for acquiring an indication of a movement of the MEMS elements and fashioned by layer deposition, and a sacrificial layer that is lower than the mechanical function layer, is fashioned by layer deposition, and is omitted in a region underneath the movable MEMS elements.