The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Feb. 17, 2017
Applicants:

Diamond Innovations, Inc., Worthington, OH (US);

Baker Hughes, a GE Company Llc, Houston, TX (US);

Inventors:

Andrew Gledhill, Westerville, OH (US);

Danny Eugene Scott, Montgomery, TX (US);

Marc William Bird, Houston, TX (US);

Assignees:

DIAMOND INNOVATIONS, INC., Worthington, OH (US);

BAKER HUGHES, a GE Company LLC, Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 18/00 (2006.01); E21B 10/567 (2006.01); C04B 35/645 (2006.01); C04B 35/528 (2006.01); C04B 35/52 (2006.01); C04B 35/63 (2006.01); C04B 35/638 (2006.01); C04B 35/64 (2006.01); C04B 35/653 (2006.01); C22B 3/00 (2006.01); C22C 26/00 (2006.01); C22F 1/10 (2006.01); E21B 10/55 (2006.01); E21B 10/54 (2006.01);
U.S. Cl.
CPC ...
E21B 10/567 (2013.01); C04B 35/52 (2013.01); C04B 35/528 (2013.01); C04B 35/6303 (2013.01); C04B 35/638 (2013.01); C04B 35/64 (2013.01); C04B 35/645 (2013.01); C04B 35/653 (2013.01); C22B 23/0407 (2013.01); C22C 26/00 (2013.01); C22F 1/10 (2013.01); C04B 2235/427 (2013.01); C04B 2235/5472 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6565 (2013.01); C04B 2235/661 (2013.01); C04B 2235/783 (2013.01); C04B 2235/85 (2013.01); C22C 2026/006 (2013.01); E21B 10/54 (2013.01); E21B 10/55 (2013.01);
Abstract

Polycrystalline diamond compacts having interstitial diamonds and methods of forming polycrystalline diamond compact shaving interstitial diamonds with a quench cycle are described herein. In one embodiment, a polycrystalline diamond compact includes a substrate and a polycrystalline diamond body attached to the substrate. The polycrystalline diamond body includes a plurality of inter-bonded diamond grains that are attached to one another in an interconnected network of diamond grains and interstitial pockets between the inter-bonded diamond grains, and a plurality of interstitial diamond grains that are positioned in the interstitial pockets. Each of the plurality of interstitial diamond grains are attached to a single diamond grain of the interconnected network of diamond grains or other interstitial diamond grains.


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