The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Jan. 19, 2018
Applicant:
Furukawa Electric Co., Ltd., Tokyo, JP;
Inventor:
Tetsuya Mieda, Tokyo, JP;
Assignee:
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 11/06 (2006.01); C09J 135/02 (2006.01); C09J 133/08 (2006.01); C09J 125/02 (2006.01); C08F 2/48 (2006.01); C08F 2/44 (2006.01); H01L 23/29 (2006.01); H01L 23/16 (2006.01); H01L 51/44 (2006.01); H01L 23/31 (2006.01); C09J 4/00 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
C09J 11/06 (2013.01); C08F 2/44 (2013.01); C08F 2/48 (2013.01); C09J 4/00 (2013.01); C09J 125/02 (2013.01); C09J 133/08 (2013.01); C09J 135/02 (2013.01); H01L 23/16 (2013.01); H01L 23/293 (2013.01); H01L 23/3135 (2013.01); H01L 51/004 (2013.01); H01L 51/0035 (2013.01); H01L 51/0043 (2013.01); H01L 51/448 (2013.01); H01L 51/5246 (2013.01); H01L 23/3121 (2013.01);
Abstract
A curable and hygroscopic resin composition for sealing electronic devices, comprising: a radically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a photo-radical polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition.