The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Oct. 19, 2017
Toray Industries, Inc., Tokyo, JP;
Benjamin Lehman, Tacoma, WA (US);
Jonathan Hughes, Tacoma, WA (US);
Swezin Than Tun, Tacoma, WA (US);
Nobuyuki Arai, Tacoma, WA (US);
Toray Industries, Inc., Tokyo, JP;
Abstract
An epoxy resin composition for a fiber-reinforced composite material, containing at least components [A], [B], [C], [D], and [E], wherein the epoxy resin composition when cured has a glass transition temperature greater than 220° C. and a storage modulus, as defined by a specific method, less than 35 MPa, as determined from an elastic shear modulus measured at a temperature of at least 35° C. higher than the glass transition temperature, wherein the components [A], [B], [C], [D], and [E] are: [A] at least one naphthalene-based epoxy resin having an EEW between 190 and 260 g/mol; [B] at least one epoxy resin having a functionality of three or more; [C] at least one amine curing agent; [D] at least one latent acid catalyst; and [E] at least one cycloaliphatic epoxy resin. This epoxy resin composition is useful in the molding of fiber-reinforced composite materials. More particularly, it is possible to offer an epoxy resin composition for a fiber-reinforced composite material where the cured material obtained by heating has high levels of heat resistance and microcrack resistance.