The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Jun. 20, 2019
Corning Incorporated, Corning, NY (US);
Oladapo Olalekan Bello, Horseheads, NY (US);
Donald Arthur Clark, Corning, NY (US);
Gregory Scott Glaesemann, Corning, NY (US);
Pascale Oram, Hammondsport, NY (US);
Charles Donahue Rizzolo, Fairport, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
Carriers for microelectronics fabrication may include a strengthened substrate formed from glass or glass-ceramic having an average thickness greater than 1.0 mm and less than or equal to 2.0 mm. The strengthened glass substrate may have a single-side surface area greater than or equal to 70,000 mm. The substrate may also have a compressive stress greater than or equal to 200 MPa and a depth of layer from about 50 μm to about 150 μm. The substrate may further include a tensile stress region having a stored elastic energy of less than 40 kJ/mproviding for a flat fragmentation factor of less than or equal to 5.