The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Feb. 28, 2018
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Sanha Kim, Cambridge, MA (US);

Anastasios John Hart, Waban, MA (US);

Piran Ravichandran Kidambi, Nashville, TN (US);

Dhanushkodi Durai Mariappan, Cambridge, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B32B 38/00 (2006.01); B32B 41/00 (2006.01); B32B 9/00 (2006.01); B32B 27/06 (2006.01); H05K 3/02 (2006.01); H05K 1/09 (2006.01); B82Y 10/00 (2011.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
B32B 37/025 (2013.01); B32B 9/005 (2013.01); B32B 27/06 (2013.01); B32B 38/0008 (2013.01); B32B 41/00 (2013.01); H05K 3/025 (2013.01); B32B 2038/0052 (2013.01); B32B 2307/204 (2013.01); B82Y 10/00 (2013.01); H01L 29/1606 (2013.01); H05K 1/097 (2013.01); H05K 2203/0152 (2013.01);
Abstract

Systems, devices, and related methods are disclosed for electromechanical transfer printing of 2D materials disposed on one substrate to another. The printing device can be configured to transfer a 2D material from a source substrate to the target substrate by applying a combination of mechanical and electrostatic forces to facilitate electromechanical adhesion between the 2D material layer and the target substrate. Some embodiments of the printing device can effect direct transfer printing of a 2D material from a source substrate to a target substrate without the use of etchants and adhesives.


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