The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Jun. 25, 2015
Koninklijke Philips N.v., Eindhoven, NL;
Vincent Adrianus Henneken, Eindhoven, NL;
Marcus Cornelis Louwerse, Eindhoven, NL;
Johannes Wilhelmus Weekamp, Eindhoven, NL;
Ronald Dekker, Eindhoven, NL;
Marc Godfriedus Marie Notten, Eindhoven, NL;
Antonia Cornelia Jeannet Van Rens, Eindhoven, NL;
KONINKLIJKE PHILIPS N.V., Eindhoven, NL;
Abstract
An ultrasound transducer arrangement () is disclosed comprising a plurality of substrate islands () spatially separated and electrically interconnected by a flexible polymer assembly () including electrically conductive tracks providing said electrical interconnections, said plurality including a first substrate island () comprising a plurality of ultra sound transducer cells () and a second substrate island () comprising an array of external contacts for connecting the ultrasound sensor arrangement to a flexible tubular body including a coaxial wire assembly () comprising a plurality of coaxial wires () each having a conductive core () covered by an electrically insulating sleeve (); and an electrically insulating body () having a first main surface (), a second main surface () and a plurality of through holes () each extending from the first main surface to the second main surface and coated with an electrically conductive member, wherein each coaxial wire comprises an exposed terminal core portion mounted in one of said though holes from the first main surface, and wherein each through hole is sealed by a solder bump () on the second main surface such that the ultrasound transducer arrangement can be directly mounted on the flexible tubular body without the need for a PCB.