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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10828663 B1

PDFFull Text
Date of Patent:
Nov. 10, 2020

Filed:

Feb. 01, 2018

Conductive fiber composites containing multi-scale high conductive particles and methods

Applicant:

Florida State University Research Foundation, Inc., Tallahassee, FL (US);

Inventors:

Shaokai Wang, Tallahassee, FL (US);

Zhiyong (Richard) Liang, Tallahassee, FL (US);

Assignee:

Florida State University Research Foundation, Inc., Tallahassee, FL (US);

Attorney:

Eversheds Sutherland (US) LLP

Primary Examiner:

Michael P Rodriguez

Int. Cl.
CPC ...
B05D 1/12 (2006.01); D06M 11/83 (2006.01); H01B 1/22 (2006.01); D06M 23/08 (2006.01); B32B 5/26 (2006.01); B32B 5/02 (2006.01); C08J 5/10 (2006.01); C08J 5/06 (2006.01); B32B 1/00 (2006.01); C08J 5/04 (2006.01); D06M 101/40 (2006.01);
U.S. Cl.
CPC ...
B05D 1/12 (2013.01); B32B 1/00 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); C08J 5/042 (2013.01); C08J 5/06 (2013.01); C08J 5/10 (2013.01); D06M 11/83 (2013.01); D06M 23/08 (2013.01); H01B 1/22 (2013.01); B32B 2250/20 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/106 (2013.01); B32B 2264/105 (2013.01); B32B 2307/30 (2013.01); B32B 2307/302 (2013.01); B32B 2307/54 (2013.01); B32B 2307/72 (2013.01); B32B 2307/732 (2013.01); B32B 2571/02 (2013.01); B32B 2605/18 (2013.01); D06M 2101/40 (2013.01);
Abstract

Composite materials are provided that include a host material, nanoscale high conductive particles, and microscale high conductive particles. The nanoscale high conductive particles and the microscale high conductive particles may increase the through thickness thermal conductivity of the composite material by at least 4.0 W/(m·K), as compared to the same composite material without the nanoscale high conductive particles and microscale high conductive particles. Methods for making the composite materials herein also are provided.

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