The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Jun. 14, 2019
Applicant:

Dr. Ing. H.c. F. Porsche Aktiengesellschaft, Stuttgart, DE;

Inventors:

Lukas Engin, Ingersheim, DE;

Michael Wessels, Bietigheim-Bissingen, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B01D 46/00 (2006.01); B32B 29/00 (2006.01); B32B 37/00 (2006.01); B32B 38/00 (2006.01); F01N 3/00 (2006.01); B26F 1/00 (2006.01); B32B 37/12 (2006.01); B32B 38/04 (2006.01); F01N 3/023 (2006.01); B01D 46/10 (2006.01); B26F 1/38 (2006.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
B01D 46/0001 (2013.01); B01D 46/006 (2013.01); B01D 46/10 (2013.01); B26F 1/38 (2013.01); B32B 7/12 (2013.01); B32B 29/005 (2013.01); B32B 37/12 (2013.01); B32B 38/04 (2013.01); F01N 3/023 (2013.01); B01D 2275/10 (2013.01); B01D 2279/30 (2013.01); B32B 2038/042 (2013.01); B32B 2250/03 (2013.01); B32B 2250/26 (2013.01); B32B 2317/12 (2013.01);
Abstract

A method is provided for producing at least one ash-forming element () for a particulate filter of an exhaust gas system of a gasoline engine or diesel engine. The method includes providing of a strip-shaped center layer (), and making receiving holes () in the center layer (). The method continues by providing of a strip-shaped bottom layer (), and permanently connecting of the bottom layer () to the center layer (). The method proceeds by filling the receiving holes () of the center layer () with ash-forming components (), providing a strip-shaped top layer (), and permanently connecting the top layer () to the center layer (). The method then includes punching out of at least one ash-forming means () from the wafer, and making throughflow openings () in regions where there are no ash-forming components ().


Find Patent Forward Citations

Loading…