The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Oct. 28, 2016
Applicant:

Ecole Polytechnique Federale DE Lausanne (Epfl), Lausanne, CH;

Inventors:

Arthur Hirsch, Lausanne, CH;

Hadrien Michaud, Lausanne, CH;

Ivan Rusev Minev, Lausanne, CH;

Stephanie P. Lacour, Daillens, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 1/00 (2006.01); A61N 1/04 (2006.01); C22C 28/00 (2006.01); C22C 5/02 (2006.01); H05K 1/02 (2006.01); A61N 1/05 (2006.01); A61B 5/0408 (2006.01); H01B 1/02 (2006.01); H05K 1/09 (2006.01); A61B 5/0478 (2006.01);
U.S. Cl.
CPC ...
A61N 1/0496 (2013.01); A61B 5/0408 (2013.01); A61N 1/0456 (2013.01); A61N 1/05 (2013.01); C22C 1/005 (2013.01); C22C 5/02 (2013.01); C22C 28/00 (2013.01); H01B 1/02 (2013.01); H05K 1/0283 (2013.01); H05K 1/09 (2013.01); A61B 5/0478 (2013.01); A61B 2562/125 (2013.01); A61B 2562/166 (2013.01); H05K 2201/0391 (2013.01); H05K 2203/128 (2013.01);
Abstract

A method for manufacturing an electrical conductor includes: depositing a solid metal conductive layer or film on a substrate; depositing a liquid metal on the solid layer; and allowing the liquid metal and the solid layerto alloy by diffusion of the liquid metal into the solid layer or film so as to form a solid conductive layer or film of the alloy; as well as allowing the liquid metal to further infiltrate the alloy so as to form percolating paths and/or droplets of the liquid metal in the the solid conductive layer or film, thus forming a biphasic conductive layer.


Find Patent Forward Citations

Loading…