The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Jul. 14, 2017
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

Steven T. Deininger, Blaine, MN (US);

Michael J. Baade, Zimmerman, MN (US);

Charles E. Peters, Blaine, MN (US);

Assignee:

MEDTRONIC, INC., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); A61B 90/50 (2016.01); A61N 1/18 (2006.01);
U.S. Cl.
CPC ...
A61B 90/50 (2016.02); A61N 1/18 (2013.01); A61N 1/3752 (2013.01); A61N 1/3754 (2013.01);
Abstract

Enclosures for implantable medical devices are machined from biocompatible materials using processes such as electric discharge machining and/or milling. Material is machined to create an enclosure. The enclosure may include an enclosure sleeve that has top and bottom caps added where the enclosure sleeve is machined either as a whole or as two separate halves that are subsequently joined together. During construction, circuitry is installed and where the enclosure includes an enclosure sleeve, the open top and bottom may be closed by caps while a connector block module may be mounted to the complete enclosure. The machining process allows materials that are typically difficult to stamp, such as grade 5 and 9 titanium and 811 titanium, that are beneficial to telemetry and recharging features of an implantable medical device to be used while allowing for an enclosure with a relatively detailed geometry and relatively tight tolerances.


Find Patent Forward Citations

Loading…