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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10827626 B1

PDFFull Text
Date of Patent:
Nov. 03, 2020

Filed:

Nov. 08, 2017

Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

Applicant:

Flex Ltd., Singapore, SG;

Inventors:

Zohair Mehkri, San Jose, CA (US);

Anwar Mohammed, San Jose, CA (US);

Jesus Tan, San Jose, CA (US);

David Geiger, Dublin, CA (US);

Murad Kurwa, San Jose, CA (US);

Assignee:

FLEX LTD, Singapore, SG;

Attorney:

Weber Rosselli & Cannon LLP

Primary Examiner:

Andargie M Aychillhum

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/34 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01); F28F 13/00 (2006.01); B23K 3/08 (2006.01); F28F 21/06 (2006.01); B23K 1/008 (2006.01); B23K 1/08 (2006.01); B23K 1/20 (2006.01); B23K 1/00 (2006.01); H05K 1/02 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3494 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/085 (2013.01); B23K 1/20 (2013.01); B23K 3/085 (2013.01); F28F 13/00 (2013.01); F28F 21/06 (2013.01); H05K 1/0201 (2013.01); H05K 1/181 (2013.01); H05K 3/0005 (2013.01); H05K 3/341 (2013.01); B23K 2101/42 (2018.08); F28F 2270/00 (2013.01); H05K 2201/10522 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/044 (2013.01);
Abstract

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

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