The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Oct. 31, 2016
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventor:

Seiichiro Shinohara, Kanuma, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); G01N 21/892 (2006.01); C09J 7/30 (2018.01); C09J 9/02 (2006.01); H01B 5/16 (2006.01); G01N 21/89 (2006.01); H01R 4/04 (2006.01);
U.S. Cl.
CPC ...
H05K 3/323 (2013.01); C09J 7/30 (2018.01); C09J 9/02 (2013.01); G01N 21/892 (2013.01); H01B 5/16 (2013.01); G01N 21/8903 (2013.01); H01R 4/04 (2013.01); H05K 2201/023 (2013.01);
Abstract

An anisotropic conductive film includes an electrically conductive particle dispersion layer, which includes electrically conductive particles dispersed, in a predetermined dispersion state, in an electrically insulating adhesive. The anisotropic conductive film includes a defective portion indication means configured to provide information about a location of a defective portion regarding the dispersion state of the electrically conductive particles. A bonding method for bonding the anisotropic conductive film to an electronic component is performed such that, in accordance with the information about the location of the defective portion, obtained from the defective portion indication means, a defect-free portion of the anisotropic conductive film is bonded to a region where terminals or terminal arrays are present in the electronic component to be anisotropically conductively connected.


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