The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Sep. 15, 2016
Applicant:

Ajinomoto Co., Inc., Tokyo, JP;

Inventors:

Shigeo Nakamura, Kanagawa, JP;

Chihiro Fujiwara, Kanagawa, JP;

Assignee:

Ajinomoto Co., Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01); H05K 3/04 (2006.01); H03K 3/10 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H05K 3/425 (2013.01); H05K 3/4682 (2013.01); H05K 3/045 (2013.01); H05K 3/108 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/025 (2013.01);
Abstract

Wiring boards, including an embedded type wiring boards and flexible wiring boards, may be produce by: (1) preparing a wiring layer-attached base including a base and a wiring layer provided on at least one surface of the base, (2) laminating an adhesive sheet including (i) a thermosetting resin composition layer and (ii) a resin film layer on the wiring layer-attached base so that the wiring layer will be embedded in (i) the thermosetting resin composition layer and performing thermal curing to form an insulating layer, (3) forming via holes in the insulating layer, (4) forming a conductor layer, and (5) removing the base.


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