The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Dec. 07, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Nicolas Degrenne, Rennes, FR;
Stefan Mollov, Rennes, FR;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/055 (2006.01); H01L 23/22 (2006.01); H01L 23/24 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/14 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 23/055 (2013.01); H01L 23/22 (2013.01); H01L 23/24 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 24/33 (2013.01); H05K 1/145 (2013.01); H05K 3/4697 (2013.01); H01L 2224/33 (2013.01); H01L 2924/00 (2013.01); H05K 1/0206 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/026 (2013.01); H05K 2201/10166 (2013.01); H05K 2203/0307 (2013.01);
Abstract
The present invention relates to a printed circuit board embedding a power die wherein interconnections between the power die and the printed circuit board are composed of micro/nano wires, the printed circuit board comprising a cavity wherein the power die is placed, and wherein the cavity is further filled with a dielectric fluid.