The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Jan. 29, 2019
Applicant:

Avago Technologies International Sales Pte. Limited, Singapore, SG;

Inventors:

Dingyou Zhang, San Jose, CA (US);

Nitesh Kumbhat, San Jose, CA (US);

Li Sun, San Jose, CA (US);

Sarah Haney, San Jose, CA (US);

Chang Kyu Choi, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01R 12/57 (2011.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01R 12/57 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09472 (2013.01);
Abstract

An electronic device includes a printed circuit board (PCB) defining a cavity, a first component pad of the PCB positioned outside the cavity, and a second component pad of the PCB positioned on a bottom surface of the cavity. The first component pad has a first thickness, and the second component pad has a second thickness that is less than the first thickness of the first component pad. An electronic component, such as a surface mounted technology (SMT) component, is mounted to the second component pad within the cavity.


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