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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10827612 B1

PDFFull Text
Date of Patent:
Nov. 03, 2020

Filed:

May. 09, 2019

Printed circuit board and electrical connector assembly using the same

Applicant:

Alltop Electronics (Suzhou) Ltd., Suzhou, Jiangsu Province, CN;

Inventors:

Mindi Ni, Suzhou, CN;

Yichang Chen, New Taipei, TW;

Assignee:

ALLTOP ELECTRONICS (SUZHOU) LTD., Suzhou, CN;

Attorney:

Cheng-Ju Chiang

Primary Examiner:

Tremesha S Willis

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01R 12/53 (2011.01); H01B 7/00 (2006.01); H01B 7/02 (2006.01); H01B 7/04 (2006.01); H01B 7/08 (2006.01); H01B 7/22 (2006.01); H01B 7/295 (2006.01); H01B 11/00 (2006.01); H01B 7/20 (2006.01); H01B 11/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01B 7/0054 (2013.01); H01B 7/0208 (2013.01); H01B 7/0225 (2013.01); H01B 7/0241 (2013.01); H01B 7/04 (2013.01); H01B 7/0853 (2013.01); H01B 7/205 (2013.01); H01B 7/228 (2013.01); H01B 7/295 (2013.01); H01B 11/00 (2013.01); H01B 11/203 (2013.01); H01R 12/53 (2013.01); H01B 7/0823 (2013.01); H05K 1/117 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/10356 (2013.01);
Abstract

A printed circuit board comprises a substrate and a routing structure arranged on the substrate, the substrate has a welding region and a routing region electrical connected with the welding region. The routing structure comprises a plurality of bonding pads connected with corresponding wires and a plurality of conductive traces electrically connected with the bonding pads, the bonding pads is arranged in the welding region, and the conductive traces are disposed in both the welding region and the routing region. The bonding pads are arranged abreast, and in the arrangement direction of the bonding pads, the bonding pads defines at least two grounding pads for connecting with grounding wires and at least a signal pad between the two grounding pads.

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