The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Jul. 29, 2019
Applicant:

Aac Acoustic Technologies (Shenzhen) Co., Ltd., Shenzhen, CN;

Inventors:

Kai Wang, Shenzhen, CN;

Hu Chen, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); B81B 7/00 (2006.01); H01L 23/00 (2006.01); H04R 19/00 (2006.01); H04R 1/04 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 7/0006 (2013.01); H01L 24/48 (2013.01); H04R 1/04 (2013.01); H04R 19/005 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/07 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48155 (2013.01); H04R 2201/003 (2013.01);
Abstract

The present disclosure provides a terminal assembly structure of a MEMS microphone, including a signal let out board disposed at a terminal and a silicon microphone disposed on the signal let out board. The silicon microphone includes a housing, a substrate forming an accommodation space with the housing, an MEMS chip and a waterproof member. The substrate is configured with a sound inlet connected to the outside. The waterproof member is sandwiched between the MEMS chip and the substrate. A position where the signal let out board corresponds to the silicon microphone is configured with an accommodation hole. The housing is accommodated in the accommodation hole. The substrate abuts a surface of the signal let out board and covers the accommodation hole. A surface of the substrate where the housing is assembled, is provided with at least one pad electrically connected with the signal let out board.


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