The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Apr. 23, 2018
Applicant:

Harman International Industries, Incorporated, Stamford, CT (US);

Inventors:

Marc Reese, Indianapolis, IN (US);

John Baumhauer, Indianapolis, IN (US);

Fengyuan Li, Carmel, IN (US);

Spiro Iraclianos, Bloomington, IN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/08 (2006.01); H04R 11/04 (2006.01); H04R 17/02 (2006.01); H04R 21/02 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 1/02 (2006.01); H04R 1/38 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/08 (2013.01); H04R 1/02 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 1/38 (2013.01); H04R 31/00 (2013.01); H04R 2201/003 (2013.01);
Abstract

In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly comprises an enclosure, a single micro-electro-mechanical systems (MEMS) transducer, a substrate layer, and an application housing. The single MEMS transducer is positioned within the enclosure. The substrate layer supports the single MEMS transducer. The application housing supports the substrate layer and defining at least a portion of a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and at least a portion of a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.


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