The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Sep. 09, 2016
Huawei Technologies Co., Ltd., Shenzhen, CN;
Hongxing Wang, Shenzhen, CN;
HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, CN;
Abstract
Embodiments of the present invention relate to the communications field, and provide a packaging method, a packaging apparatus, and a terminal, so as to improve evenness of an adhesive layer and reduce an adhesive overflow probability, thereby improving packaging efficiency and a defect-free rate of terminals. The method includes: forming an adhesive layer on a packaging surface of a packaging module, where a shape and a size of the adhesive layer adapt to the packaging surface; and fastening, into a terminal housing, the packaging module on which the adhesive layer is formed, so that the adhesive layer is filled between the packaging surface and a side wall of the housing.