The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Mar. 21, 2017
Applicant:

Iljin Materials Co., Ltd., Iksan, KR;

Inventors:

Tae Jin Jo, Iksan, KR;

Sun Hyoung Lee, Iksan, KR;

Seul-Ki Park, Iksan, KR;

Ki Deok Song, Iksan, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21C 37/02 (2006.01); H01M 10/0562 (2010.01); C25D 3/38 (2006.01); C01B 32/184 (2017.01); C25D 1/04 (2006.01); C25D 7/06 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
H01M 10/0562 (2013.01); C01B 32/184 (2017.08); C25D 1/04 (2013.01); C25D 3/38 (2013.01); C25D 7/0614 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); Y10T 428/12431 (2015.01);
Abstract

The present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil. More particularly, the present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil, which may facilitate formation of graphene by blocking surface deformation during the electrolytic copper foil formation. In accordance with the present disclosure, the Rz roughness of the S-face of the electrolytic copper foil after 1 hour treatment at 200° C. in the synthesis of graphene on the electrolytic copper foil is defined based on the Relationship 1 below. This may also minimize the deformation of the surface of the electrolytic copper foil at high temperatures:0.05≤(roughness of-face of electrolytic copper foil/roughness of-face after treatment at 200° C. for 1 hour)/thickness of electrolytic copper foil≤0.2.  Relationship 1:


Find Patent Forward Citations

Loading…