The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Aug. 06, 2015
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Takeshi Yanagita, Tokyo, JP;

Yasushi Tateshita, Kanagawa, JP;

Kazunobu Ota, Tokyo, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 5/374 (2011.01); H01L 27/148 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14692 (2013.01); H01L 27/1464 (2013.01); H01L 27/14605 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14643 (2013.01); H01L 27/14649 (2013.01); H01L 27/14685 (2013.01); H01L 27/14689 (2013.01); H04N 5/374 (2013.01); H01L 27/148 (2013.01); H01L 27/14621 (2013.01);
Abstract

In an image pickup element, an interval between adjacent light receiving elements on a light receiving surface is changed depending on a position on the light receiving surface. Further, the image pickup element is manufactured by a method of manufacturing the image pickup element including layering photodiodes by repeatedly performing a silicon epitaxial process and an ion injection process. Further, the image pickup element is manufactured by the method of manufacturing the image pickup element including changing an interval between the photodiodes adjacent on the light receiving surface of the image pickup element in each layer depending on a position on the light receiving surface in addition to the layering thereof.


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