The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Sep. 02, 2019
Applicant:
Nichia Corporation, Anan-shi, JP;
Inventors:
Kenji Ozeki, Tokushima, JP;
Hiroki Fukuta, Anan, JP;
Assignee:
NICHIA CORPORATION, Anan-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 33/56 (2010.01); H01L 33/52 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/00 (2010.01); H01L 23/00 (2006.01); H01L 33/50 (2010.01); H01L 23/24 (2006.01); H01L 25/07 (2006.01); H01L 25/075 (2006.01); H01L 27/02 (2006.01); H01L 29/866 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 24/26 (2013.01); H01L 24/73 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 33/0095 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 23/24 (2013.01); H01L 25/072 (2013.01); H01L 25/0753 (2013.01); H01L 27/0248 (2013.01); H01L 29/866 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/26155 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/92225 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/1811 (2013.01); H01L 2924/19105 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0091 (2013.01);
Abstract
A light emitting device includes a substrate, light emitting elements, light transmissive members, an underfill, and a cover member. The light emitting elements are mounted on the substrate. The light transmissive members are each disposed on an upper surface of each of the light emitting elements. The underfill covers an upper surface of the substrate, lateral surfaces of the light emitting elements, and lateral surfaces of the light transmissive members between the light transmissive members. The cover member covers an upper surface of the underfill and has a hardness greater than a hardness of the underfill.