The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Oct. 01, 2018
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Wei-Cheng Chu, Miao-Li County, TW;

Ming-Fu Jiang, Miao-Li County, TW;

Chia-Cheng Liu, Miao-Li County, TW;

Tong-Jung Wang, Miao-Li County, TW;

Assignee:

Innolux Corporation, Chu-Nan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 25/18 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 25/105 (2013.01); H01L 25/18 (2013.01); H01L 27/1244 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 27/124 (2013.01); H01L 27/1255 (2013.01); H01L 2224/02185 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05007 (2013.01); H01L 2224/0568 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05111 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/11332 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/13344 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13355 (2013.01); H01L 2224/13364 (2013.01); H01L 2224/13499 (2013.01); H01L 2224/16014 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16147 (2013.01); H01L 2224/27332 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29035 (2013.01); H01L 2224/29076 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73103 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/8185 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83204 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/9211 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1426 (2013.01);
Abstract

A first electronic element is disclosed, which includes: a first substrate having a first surface; a first electrode pad disposed on the first surface, wherein the first electrode pad has a second surface away from the first substrate; and an insulating layer disposed on the first surface, wherein the insulating layer includes an opening, the opening is disposed correspondingly to the first electrode pad, and the opening overlaps the first electrode pad in a normal direction of the first surface, wherein the insulating layer has a third surface away from the first substrate, a distance between the third surface and the second surface in the normal direction of the first surface is defined as a first distance, and the first distance is greater than 0 μm and less than or equal to 14 μm. In addition, the disclosure further provides an electronic device including the first electronic element.


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