The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Aug. 01, 2018
Applicant:
Nxp B.v., Eindhoven, NL;
Inventors:
Chia Hao Kang, Kaohsiung, TW;
Chung Hsiung Ho, Kaohsiung, TW;
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 25/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/367 (2013.01); H01L 23/3736 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 25/50 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02371 (2013.01);
Abstract
A packaged semiconductor device has a conductive film that covers a first major surface and surrounding side surfaces of an integrated circuit die. The conductive film provides five-sided shielding of the integrated circuit die. A metal heat sink may be attached to an exposed major surface of the conductive film for dissipating heat generated by the die.