The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Mar. 04, 2019
Applicants:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Toshiba Electronic Devices & Storage Corporation, Minato-ku, JP;
Inventors:
Hideharu Kojima, Kanazawa, JP;
Yoshiharu Takada, Nonoichi, JP;
Assignees:
KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 21/00 (2006.01); H05K 7/12 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 21/4821 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 24/32 (2013.01); H01L 2224/16012 (2013.01); H01L 2224/16104 (2013.01); H01L 2224/29026 (2013.01); H01L 2224/32012 (2013.01); H01L 2224/32104 (2013.01);
Abstract
According to one embodiment, a semiconductor device includes a semiconductor chip, and a die pad. The die pad has a first surface. The semiconductor chip is bonded on the first surface using a paste including a metal particle. A concave structure is provided in the first surface. The concave structure is positioned directly under each of a plurality of sides of the semiconductor chip and extends along each of the plurality of sides.