The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Jul. 16, 2020
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Tomohisa Fukuoka, Tokyo, JP;

Tetsuhiro Takahashi, Tokyo, JP;

Akinori Ohi, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/00 (2006.01); H01G 4/30 (2006.01); H01G 4/248 (2006.01); H01G 4/012 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/248 (2013.01); H05K 1/11 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01);
Abstract

To improve a mounting reliability while maintaining a thickness of the external electrode at a side face of a multilayer electronic component thin. The multilayer electronic component includes ceramic body in which ceramic layers and an external electrode formed to an end face of the ceramic body. The upper electrode layer includes an element having higher standard electrode potential than Cu. The external electrode includes an external electrode end part and an external electrode extension part which is integrally formed with the external electrode end part. 1.20≤t2/t1≤4.50 is satisfied in which t1 is a total thickness of a thickness of the intermediate electrode layer thickness and t2 is a length from an end of the base electrode layer to an end of the upper electrode layer along the first axis of the external electrode extension part connected by the conductive adhesive.


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