The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Jan. 13, 2019
Applicants:

David Finn, Tourmakeady, IE;

Mustafa Lotya, Celbridge, IE;

Darren Molloy, Galway, IE;

Inventors:

David Finn, Tourmakeady, IE;

Mustafa Lotya, Celbridge, IE;

Darren Molloy, Galway, IE;

Assignee:

Féinics AmaTech Teoranta, Lower Churchfield Tourmakeady, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01); G06K 19/077 (2006.01); H01Q 1/22 (2006.01); H01Q 21/29 (2006.01); H01Q 7/00 (2006.01); H05K 1/16 (2006.01); H04B 5/00 (2006.01); H05K 3/10 (2006.01); H01F 38/14 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07794 (2013.01); G06K 19/07769 (2013.01); G06K 19/07783 (2013.01); H01Q 1/2216 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/2283 (2013.01); H01Q 7/00 (2013.01); H01Q 21/29 (2013.01); H04B 5/00 (2013.01); H05K 1/165 (2013.01); H01F 38/14 (2013.01); H05K 3/103 (2013.01); H05K 2201/10098 (2013.01); Y10T 29/49018 (2015.01); Y10T 29/49162 (2015.01);
Abstract

A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard.


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