The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Nov. 16, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 12/00 (2006.01); G06F 13/40 (2006.01); G11C 5/02 (2006.01); G11C 8/12 (2006.01); G11C 7/22 (2006.01); G11C 5/06 (2006.01); G06F 13/42 (2006.01); G11C 5/04 (2006.01); G11C 11/4063 (2006.01); G11C 7/10 (2006.01); G06F 13/16 (2006.01); G11C 29/02 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4063 (2013.01); G06F 13/1647 (2013.01); G06F 13/4243 (2013.01); G11C 5/025 (2013.01); G11C 5/04 (2013.01); G11C 5/063 (2013.01); G11C 7/1048 (2013.01); G11C 7/1066 (2013.01); G11C 7/22 (2013.01); G11C 7/222 (2013.01); G11C 8/12 (2013.01); G11C 11/4063 (2013.01); G11C 29/025 (2013.01); H05K 2201/10159 (2013.01);
Abstract
A semiconductor device includes a plurality of memory chips arranged in a line on a substrate, and a bus connected to the plurality of memory chips and configured to sequentially supply an electrical signal to the plurality of memory chips in accordance with a fly-by topology. An order in which the electrical signal is supplied to the plurality of memory chips is different from an order in which the plurality of memory chips is arranged in the line on the substrate.