The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Oct. 05, 2016
Applicant:
Carrier Corporation, Palm Beach Gardens, FL (US);
Inventors:
John Carl Christenson, Prior Lake, MN (US);
David P. Potasek, Lakeville, MN (US);
Marcus Allen Childress, Farmington, MN (US);
Assignee:
CARRIER CORPORATION, Palm Beach Gardens, FL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 27/14 (2006.01); G01N 33/00 (2006.01); G01N 27/12 (2006.01); B81B 7/02 (2006.01);
U.S. Cl.
CPC ...
G01N 27/14 (2013.01); B81B 7/02 (2013.01); G01N 27/128 (2013.01); G01N 33/0004 (2013.01); G01N 33/0027 (2013.01); G01N 33/0036 (2013.01); B81B 2201/00 (2013.01); B81B 2201/02 (2013.01); B81B 2201/0214 (2013.01);
Abstract
A microelectromechanical systems die including a thermally conductive substrate including an outer surface, a plurality of low mass sensing structures disposed within the thermally conductive substrate to form a plurality of inter-structure spaces therebetween, each of the plurality of low mass sensing structures include a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension.