The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Mar. 13, 2014
Applicants:

President and Fellows of Harvard College, Cambridge, MA (US);

Rolls-royce Canada, Ltd., Lachine Montreal, CA;

Inventors:

Katia Bertoldi, Somerville, MA (US);

Michael Taylor, Medford, MA (US);

Ali Shanian, Montreal, CA;

Miklos Gerendas, Mellensee, DE;

Carl Carson, Beaconsfield, CA;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/24 (2006.01); F23R 3/00 (2006.01); F23R 3/06 (2006.01); B23K 15/08 (2006.01); B23K 26/38 (2014.01); B32B 3/26 (2006.01);
U.S. Cl.
CPC ...
F23R 3/002 (2013.01); B23K 15/08 (2013.01); B23K 26/38 (2013.01); F23R 3/06 (2013.01); B32B 3/266 (2013.01); F23M 2900/05004 (2013.01); F23R 2900/00005 (2013.01); Y10T 428/24314 (2015.01);
Abstract

Void structures, systems and devices with void structures, and methods of fabricating void structures are disclosed. A void structure is disclosed with a repeating elongated-aperture pattern designed to provide negative Poisson's Ratio behavior under macroscopic stress and strain loading. The pattern can include horizontal and vertical elliptically shaped apertures that are arranged on horizontal and vertical lines in a way that the lines are equally spaced in both dimensions. The centers of each aperture is on a crossing point of two of the lines. The vertical and horizontal elliptically shaped apertures alternate on the vertical and horizontal lines such that any vertical aperture is surrounded by horizontal apertures along the lines (and vice versa), and the next vertical apertures are found on both diagonals. The voids can also act as cooling and/or damping holes and, due to their arrangement, also as stress reduction features.


Find Patent Forward Citations

Loading…