The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Sep. 15, 2019
Applicants:

Lite-on Electronics (Guangzhou) Limited, Guangzhou, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Ching-Tang Fu, Taoyuan, TW;

Chia-Jung Tsai, Kaohsiung, TW;

Han-Ming Lee, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 21/00 (2006.01); H01L 21/50 (2006.01); H01L 21/58 (2006.01); H01L 21/60 (2006.01); H01L 23/48 (2006.01); H01L 23/488 (2006.01); F21S 41/19 (2018.01); H05K 1/18 (2006.01); H01L 33/62 (2010.01); H05K 3/34 (2006.01); F21S 41/151 (2018.01); F21Y 115/10 (2016.01); F21Y 103/10 (2016.01);
U.S. Cl.
CPC ...
F21S 41/192 (2018.01); F21S 41/151 (2018.01); H01L 33/62 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/3431 (2013.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); H01L 2933/0066 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/166 (2013.01);
Abstract

Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.


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