The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Sep. 05, 2017
Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventor:

Woo-Seok Cheong, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 7/12 (2006.01); C25D 5/02 (2006.01); C25D 21/10 (2006.01); C25D 17/00 (2006.01); C25D 17/12 (2006.01); C25D 5/16 (2006.01); C25D 5/18 (2006.01); H01L 21/768 (2006.01); C25D 17/06 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
C25D 7/123 (2013.01); C25D 5/022 (2013.01); C25D 5/16 (2013.01); C25D 5/18 (2013.01); C25D 17/001 (2013.01); C25D 17/004 (2013.01); C25D 17/12 (2013.01); C25D 21/10 (2013.01); H01L 21/76829 (2013.01); H01L 21/76873 (2013.01); C25D 3/38 (2013.01); C25D 17/06 (2013.01);
Abstract

An electroplating apparatus includes a substrate, a seed layer provided on a top surface of the substrate, a high-voltage portion provided on a bottom surface of the substrate, a housing sealing the high-voltage portion, an anode structure spaced apart from the seed layer in a direction perpendicular to the top surface of the substrate, first power source generating a first voltage difference between the seed layer and the anode structure, and a second power source applying a second voltage to the high-voltage portion. A positive terminal of the first power source is electrically connected to the anode structure, and a negative terminal of the first power source is electrically connected to the seed layer.


Find Patent Forward Citations

Loading…