The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Mar. 08, 2019
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Tien-Shou Shieh, Hsinchu, TW;
Pei-Hsin Chien, Taichung, TW;
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
C09D 163/00 (2006.01); C08G 59/24 (2006.01); C09D 7/47 (2018.01); C08G 59/18 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C08G 59/186 (2013.01); C08G 59/245 (2013.01); C09D 7/47 (2018.01); C08G 2150/00 (2013.01);
Abstract
A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa·s to 80 Pa·s at 25° C.