The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Oct. 03, 2017
Applicant:
Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Inventor:
Philippe Robert, Grenoble, FR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/02 (2006.01); B81C 1/00 (2006.01); H04R 17/00 (2006.01); B81B 7/00 (2006.01); H01L 23/00 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
B81B 7/02 (2013.01); B81B 7/0061 (2013.01); B81C 1/00047 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/0353 (2013.01); B81B 2207/012 (2013.01); B81B 2207/096 (2013.01); H01L 23/13 (2013.01); H01L 24/32 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/92147 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/16152 (2013.01);
Abstract
An electromechanical pressure sensor system, in particular microphone type, including an electromechanical transducer, signal processing device, a substrate for receiving at least one support of the electromechanical transducer and/or signal processing device, a protective cover arranged on the upper face of the substrate, the support of the electromechanical transducer and/or signal processing device being housed in at least one cavity located on the lower face of the substrate is disclosed.