The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Jul. 06, 2017
Applicant:
Honeywell International Inc., Morris Plains, NJ (US);
Inventors:
Assignee:
Honeywell International Inc., Charlotte, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81C 1/00 (2006.01); H01L 41/113 (2006.01); H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0051 (2013.01); B81B 3/0059 (2013.01); B81C 1/0038 (2013.01); H01L 29/84 (2013.01); H01L 41/113 (2013.01); B81B 2201/0228 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2203/04 (2013.01); B81C 2201/0181 (2013.01); H01L 41/1132 (2013.01); H01L 2924/1461 (2013.01);
Abstract
A micro-electro-mechanical systems (MEMS) device and method of fabricating the MEMS device are disclosed. The MEMS device comprises a substrate, one or more suspension structures connected to the substrate, one or more metallized layers on the one or more suspension structures, and one or more sense structures connected to the one or more suspension structures. The one or more metallized layers provide selectively adjusted damping of the one or more suspension structures.