The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Oct. 27, 2017
Mitsui High-tec, Inc., Kitakyushu, JP;
Hirotoshi Mabu, Kitakyushu, JP;
Other;
Abstract
A resin injection apparatus includes: a mold die and a receiving die configured to hold a core body in an axial direction of the core body, the core body having a resin formation region serving as a region where resin is to be formed by injection of molten resin; a plurality of plungers; and a pot group attached to the mold die, the pot group including a plurality of pots proximately located next to each other in a direction. Each of the plurality of pots has a through hole in which a corresponding plunger of the plungers is insertable. The plurality of pots have a first coefficient of thermal expansion that is lower than a second coefficient of thermal expansion of the mold die.