The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Mar. 20, 2018
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Suk-Hoon Jeong, Hwaseong-si, KR;
Sang-Hak Lee, Hwaseong-si, KR;
Geun-Kyu Choi, Hwaseong-si, KR;
Chang-Sun Hwang, Hwaseong-si, KR;
Tae-Young Kwon, Seoul, KR;
Young-Sang Kim, Seoul, KR;
Hyung-Kyu Jin, Hwaseong-si, KR;
Jeong-Nam Han, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A method of controlling a chemical mechanical polishing (CMP) process, a temperature control, and a CMP apparatus, the method including measuring actual temperatures of at least two regions in a platen in real time during the CMP process in which a polishing pad attached to the platen polishes a substrate held by a polishing head using slurry and deionized water; receiving the measured actual temperatures of the regions; and individually controlling the actual temperatures of the regions in real time during the CMP process to provide the regions with a predetermined set CMP process temperature.