The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Oct. 24, 2018
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Patrick Michael Kenney, Cincinnati, OH (US);

Dustin Eugene Lindley, Cincinnati, OH (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/105 (2006.01); B33Y 50/00 (2015.01); C22C 1/04 (2006.01); B29C 64/153 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B22F 3/1055 (2013.01); B29C 64/153 (2017.08); B33Y 10/00 (2014.12); B33Y 50/00 (2014.12); C22C 1/0416 (2013.01); B22F 2003/1057 (2013.01); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 70/00 (2014.12); Y02P 10/25 (2015.11);
Abstract

A method and apparatus for fabricating an object. The method and apparatus entail applying a pulsed laser energy to a first quantity of a powder material on a substrate so as to fuse particles of the powder material into a first layer on the substrate, and then forming at least one additional layer on the first layer by applying a pulsed laser energy to at least a second quantity of the powder material on the first layer so as to fuse particles of the powder material into the at least one additional layer on the first layer. The pulsed laser energy is applied in a controlled manner such that solidification dynamics of the first and second quantities of the powder material are altered to promote at least one microstructural characteristic of the first and additional layer.


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