The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Jun. 20, 2019
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Wei-Cheng Chu, Miao-Li County, TW;

Chia-Cheng Liu, Miao-Li County, TW;

Chih-Yuan Lee, Miao-Li County, TW;

Chin-Lung Ting, Miao-Li County, TW;

Tong-Jung Wang, Miao-Li County, TW;

Assignee:

Innolux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01); H05K 3/36 (2006.01); H01L 21/02 (2006.01); H01L 21/44 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01J 17/02 (2006.01); H01J 17/34 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 1/14 (2006.01); G02F 1/1345 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); G02F 1/13452 (2013.01); H05K 1/028 (2013.01); H05K 1/111 (2013.01); H05K 1/14 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H05K 3/06 (2013.01); H05K 3/323 (2013.01); H05K 3/361 (2013.01); H05K 3/4644 (2013.01); G02F 1/13458 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/0502 (2013.01);
Abstract

A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.


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