The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
Jul. 15, 2019
Applicant:
Abb Schweiz Ag, Baden, CH;
Inventor:
Robert Joseph Roessler, Wylie, TX (US);
Assignee:
ABB POWER ELECTRONICS INC., Plano, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0265 (2013.01); H05K 1/0298 (2013.01); H05K 1/113 (2013.01); H05K 1/115 (2013.01); H05K 3/0047 (2013.01); H05K 3/303 (2013.01); H05K 3/424 (2013.01); H05K 3/429 (2013.01); H05K 2201/098 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10166 (2013.01); H05K 2203/1476 (2013.01); Y10T 29/49165 (2015.01);
Abstract
In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).