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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10820418 B1

PDFFull Text
Date of Patent:
Oct. 27, 2020

Filed:

Dec. 16, 2014

Electronic module, method for manufacturing same and electronic device comprising a module of said type

Applicant:

Gemalto SA, Meudon, FR;

Inventors:

Alain Le Loc'h, Gemenos, FR;

Jean-Marie Bertolotti, Gemenos, FR;

Jean-Christophe Fidalgo, Gemenos, FR;

Assignee:

THALES DIS FRANCE SA, Meudon, FR;

Attorney:

Buchanan Ingersoll & Rooney PC

Primary Examiner:

Nathan Milakovich

Int. Cl.
CPC ...
G06K 19/077 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/12 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01); H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); G06K 19/07747 (2013.01); G06K 19/07775 (2013.01); H01Q 1/38 (2013.01); H05K 1/097 (2013.01); H05K 1/111 (2013.01); H05K 3/125 (2013.01); H05K 3/1275 (2013.01); H05K 3/32 (2013.01); H05K 3/4007 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49171 (2013.01);
Abstract

The invention relates to an electronic module comprising a dielectric support film having a first side, conductor paths that are printed on said first side, and a semiconductor component which connects the conductor paths by means of electrical connections. The electronic module of the invention is characterized in that each electrical connection includes a lead wire that connects a contact of the semiconductor component to each path directly or via an island or an interconnection pad.

Find Patent Forward Citations

Le Loc'h, Alain. (2020). Electronic module, method for manufacturing same and electronic device comprising a module of said type (U.S. Patent No. 10820418). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10820418

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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