The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Apr. 17, 2019
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jinho Lim, Gyeonggi-do, KR;

Seungjae Bae, Gyeonggi-do, KR;

Yonghwa Kim, Gyeonggi-do, KR;

Jinyoung Park, Gyeonggi-do, KR;

Bokyung Sim, Gyeonggi-do, KR;

Byounguk Yoon, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/02 (2006.01); H04M 1/03 (2006.01); H04R 1/32 (2006.01);
U.S. Cl.
CPC ...
H04M 1/03 (2013.01); H04R 1/02 (2013.01); H04R 1/326 (2013.01);
Abstract

A conduit structure of an electronic device and an electronic device are provided. The conduit structure includes an inner structure including a front surface and a rear surface, wherein the front surface includes a first region configured to receive a display and a second region, which is a remaining area of the front surface of the inner structure; a receiver hole configured to penetrate the second region and to connect a receiver receiving space and an external space of the inner structure; a first through-hole configured to penetrate the first region and to connect the receiver receiving space and the front surface of the inner structure; a second through-hole, which is spaced apart from the first through-hole, configured to penetrate the first region and to connect the rear surface of the inner structure; and a flow path configured to connect the first through-hole and the second through-hole at the front surface of the inner structure.


Find Patent Forward Citations

Loading…