The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Aug. 03, 2017
Applicant:

Wuhan China Star Optoelectronics Technology Co., Ltd., Wuhan, Hubei, CN;

Inventor:

Songshan Li, Hubei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/786 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); G02F 1/13357 (2006.01);
U.S. Cl.
CPC ...
H01L 27/127 (2013.01); H01L 27/1248 (2013.01); H01L 27/1262 (2013.01); H01L 29/7869 (2013.01); H01L 29/78618 (2013.01); H01L 51/5206 (2013.01); H01L 51/5237 (2013.01); H01L 51/56 (2013.01); G02F 1/133603 (2013.01);
Abstract

Disclosed is a method for manufacturing a thin film transistor, and a thin film transistor, relating to the technical field of liquid crystal display. The method comprises steps of: forming a buffer layer, an active layer, a gate insulator layer, and a gate electrode layer successively on a glass substrate and patterning these layers; forming an inter-layer dielectric layer on the buffer layer, the active layer, and the gate electrode layer and patterning the inter-layer dielectric layer; forming a source and a drain on the inter-layer dielectric layer, enabling the source and the drain to come into contact with the active layer, and patterning the source and the drain; forming a passivation layer and an organic photoresist layer successively on the inter-layer dielectric layer, the source, and the drain, and patterning the organic photoresist layer; dry-etching the passivation layer by using the organic photoresist layer as a mask, so as to form a hole on the passivation layer; and forming an organic light-emitting device by means of the hole on the passivation layer. The method saves a mask, requires simple techniques, and saves manufacturing costs. Besides, the developer is not able to come into direct contact with exposed aluminum of the source and the drain resulted from etching of the passivation layer. The method thus achieves the aim of improving product characteristics.


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