The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Jul. 12, 2017
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Alejandro Aldrin Il A. Narag, Singapore, SG;

Ravi Palaniswamy, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H05K 1/117 (2013.01); H05K 3/0052 (2013.01); H05K 3/0097 (2013.01); H05K 3/403 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49113 (2013.01); H05K 2201/049 (2013.01); H05K 2201/09145 (2013.01); H05K 2201/09463 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A flexible multilayer construction () for mounting a plurality of light emitting semiconductor devices (LESDs) includes a flexible dielectric substrate () comprising top () and bottom () major surfaces, and pluralities of corresponding electrically conductive top () and bottom () pads disposed on the top and bottom major surfaces, respectively. An electrically conductive via () connects each pair of corresponding top and bottom pads, a side of each top pad partially overlapping a side of the corresponding bottom pad and a side of the substrate, such that in a plan view, each top pad fully overlaps the corresponding bottom pad.


Find Patent Forward Citations

Loading…