The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
Sep. 13, 2016
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventors:
Assignee:
Renesas Electronics Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/485 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 21/565 (2013.01); H01L 23/485 (2013.01); H01L 23/49816 (2013.01); H01L 24/06 (2013.01); H01L 24/12 (2013.01); H01L 24/16 (2013.01); H01L 24/46 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 25/0657 (2013.01); H01L 22/32 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 24/78 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/02205 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/0568 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05084 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05157 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05169 (2013.01); H01L 2224/05173 (2013.01); H01L 2224/05181 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05564 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05583 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/06183 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29198 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/4502 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45164 (2013.01); H01L 2224/45169 (2013.01); H01L 2224/46 (2013.01); H01L 2224/4807 (2013.01); H01L 2224/4868 (2013.01); H01L 2224/4878 (2013.01); H01L 2224/4888 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48158 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48453 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48507 (2013.01); H01L 2224/48624 (2013.01); H01L 2224/48639 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48647 (2013.01); H01L 2224/48655 (2013.01); H01L 2224/48664 (2013.01); H01L 2224/48724 (2013.01); H01L 2224/48739 (2013.01); H01L 2224/48744 (2013.01); H01L 2224/48747 (2013.01); H01L 2224/48755 (2013.01); H01L 2224/48764 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/48839 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/48864 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85186 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85464 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01011 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01061 (2013.01); H01L 2924/01065 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/04953 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/078 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/3511 (2013.01);
Abstract
In a method of manufacturing a semiconductor device, a semiconductor chip has first and second pads, a passivation film formed such that respective parts of the first and second pads are exposed, a first surface-metal-layer provided on the part of the first pad and a part of the passivation film, and a second surface-metal-layer provided on the part of the second pad and another part of the passivation film. Respective wires are electrically connected to the first and second surface-metal-layers. The semiconductor chip and the respective wires are then sealed with a resin.