The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Sep. 28, 2018
Applicant:

Macom Technology Solutions Holdings, Inc., Lowell, MA (US);

Inventor:

Kohei Fujii, San Jose, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01); H03F 3/195 (2006.01); H01L 23/043 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/043 (2013.01); H01L 24/49 (2013.01); H03F 3/195 (2013.01); H01L 2223/6683 (2013.01); H01L 2924/1423 (2013.01);
Abstract

Examples of a package for a flange mount device are described. In one example, the package includes a thermally conductive base, a base substrate, and a lid having a cavity. The base substrate includes a through hole and radio frequency (RF) input, RF output, and bias traces that extend to a perimeter of the through hole. The lid includes a cavity and RF input coupling, RF output coupling, and bias coupling traces. A device can be secured to the thermally conductive base, and the lid can be secured to the thermally conductive base, with the base substrate secured between the lid and the thermally conductive base, coupling the traces of the base substrate to the traces of the lid. Other components, such as biasing, blocking, and bypassing components can be easily integrated into the package. Impedance matching and electromagnetic shielding components can also be easily integrated into the package.


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