The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Dec. 06, 2017
Applicants:

Institut Vedecom, Versailles, FR;

Elvia Pcb, Coutances, FR;

Inventors:

Friedbald Kiel, Fontainebleau, FR;

Olivier Belnoue, Ondreville-sur-Essonne, FR;

Assignees:

INSTITUT VEDECOM, Versailles, FR;

ELVIA PCB, Coutances, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/11 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 24/25 (2013.01); H01L 24/82 (2013.01); H01L 25/115 (2013.01); H01L 25/117 (2013.01); H01L 23/473 (2013.01); H01L 2224/2518 (2013.01);
Abstract

The circuit comprises at least one electronic chip (MT, MD), a laminated substrate and heat sink means, the chip being implanted in the substrate and the heat sink means being secured to opposing faces of the substrate. According to the invention, the heat sink means comprise heat-sink-forming bus-bars (BB, BB) mounted on the opposing faces of the substrate, each of said bus-bars being formed by a plurality of metal segments (BB, BB, BB, BB; BB, BB, BB) secured at spaced-apart positions and interconnected with one another and with a contact face of the electronic chip (MT, MD) by means of a metal layer (ME, ME).


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