The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Jun. 25, 2020
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Yoshinori Deguchi, Gunma, JP;

Akinobu Watanabe, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/535 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 21/66 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); H01L 21/3205 (2006.01);
U.S. Cl.
CPC ...
H01L 23/535 (2013.01); H01L 21/3205 (2013.01); H01L 21/768 (2013.01); H01L 22/32 (2013.01); H01L 23/522 (2013.01); H01L 23/5226 (2013.01); H01L 23/5384 (2013.01); H01L 23/562 (2013.01); H01L 23/585 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/45 (2013.01); H01L 2224/05 (2013.01); H01L 2224/05013 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device includes a semiconductor substrate SB and a wiring structure formed on a main surface of the semiconductor substrate SB. The uppermost first wiring layer among a plurality of wiring layers included in the wiring structure includes a pad PD, and the pad PD has a first region for bonding a copper wire and a second region for bringing a probe into contact with the pad. A second wiring layer that is lower by one layer than the first wiring layer among the plurality of wiring layers included in the wiring structure includes a wiring line Marranged immediately below the pad PD, the wiring line Mis arranged immediately below a region other than the first region of the pad PD, and no conductor pattern in the same layer as a layer of the wiring line Mbelong is formed immediately below the first region of the pad PD.


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