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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10818573 B1

PDFFull Text
Date of Patent:
Oct. 27, 2020

Filed:

Aug. 26, 2015

Power semiconductor module with heat dissipation plate

Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Nobutake Tsuyuno, Tokyo, JP;

Takeshi Tokuyama, Hitachinaka, JP;

Eiichi Ide, Tokyo, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Hoa B Trinh

Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/367 (2006.01); H01L 23/29 (2006.01); H01L 25/18 (2006.01); H01L 21/56 (2006.01); H01L 23/433 (2006.01); H01L 23/24 (2006.01); H01L 25/07 (2006.01); H01L 23/31 (2006.01); H01L 23/04 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/565 (2013.01); H01L 23/041 (2013.01); H01L 23/24 (2013.01); H01L 23/29 (2013.01); H01L 23/3121 (2013.01); H01L 23/4334 (2013.01); H01L 23/473 (2013.01); H01L 25/07 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33 (2013.01); H01L 2224/40137 (2013.01); H01L 2924/181 (2013.01);
Abstract

An object of the present invention is to provide a structure, particularly, a power semiconductor module, which suppresses a bypass flow of a cooling medium and improves cooling efficiency. A structure according to the present invention includes a heat dissipation plate thermally connected to a heating element, and a resin region having a resin material that fixes the heating element and the heat dissipation plate, wherein the heat dissipation plate includes a fin portion including a plurality of fins protruding from a heat dissipation surface of the heat dissipation plate and formed to be exposed from the sealing resin material, and a wall portion formed to protrude from the heat dissipation surface to a same side as the fin and which separates the fin portion and the resin region.

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